Swissmade
NEWS
19/02/2019
MEASUREMENT

Release of cDASY6 Module mmWave V1.6

SPEAG’s latest software release incorporates many new features and improvements to facilitate power compliance testing of devices operating >10 GHz

With cDASY6 Module mmWave V1.6, power density compliance testing is now easier than ever:

  • A new Generic Scan that allows determination of the power density with the far-field approximation based on a single plane measurement has been added. Now, assessments valid in the far-field and quasi-far-field are much faster compared to generally valid 2-plane method with phase reconstruction
  • The Generic Scan also allows to determine the E-field amplitude anywhere with a one plane measurement
  • The user can create test channels at any frequency
  • The grid settings are now more open, allowing more flexible and user-friendly operation of the software
  • The measurement grid can now be previewed for all scan types
  • The power density results for different averaging areas can now be visualized simultaneously
  • Completed measurements can be re-evaluated with different communication systems
  • The computation time to post-process scans has been speeded up by x4 on average
  • The report generator, in particular the screenshot functionality, has been improved
  • The measured data can now be exported at any grid resolution
  • The power density viewers show now the location of psSavg

New Generic 2D Scan

The new Generic 2D Scan is used to compute the E-field and estimate the power density on a rectangular two-dimensional grid. The power density value, derived from the E-field distribution without any phase reconstruction, is valid in the far-field only. cDASY6 allows the far-field distance to be determined as function of the antenna radius based on the latest research. This feature dramatically speeds up the time for measurements in the far-field region (by x8 on average).

cDASY6 mmWave Module V1.6 Generic Scan

Power distribution measured with the generic 2D scan in the far field from the source (1-plane)

Custom Test Channels

Custom test channels can be now added in V1.6. This feature allows to test at any frequency even for bands not yet added to the mmWave module.

Grid Settings Flexibility

The flexibility of the grid settings has been greatly improved in V1.6. It is now possible to:

  • Offset the position of the device-under-test relative to the reference point
  • Manually offset and resize the Fast Area Scan grid
  • Define the 5G scan-grid based on the Fast Area Scan

Further, measurements for all scan types can now be previewed.

cDASY6 mmWave Module V1.6 Grid Preview

Grid scan preview with cDASY6 Module mmWave V1.6

Re-Evaluation of Completed Measurements

With V1.6, we have added the possibility to re-evaluate already completed measurements with any communication system. The specificities in hardware (probes, DAE) design do not allow similar re-evaluations based on different hardware components. In these cases, new measurements with the desired hardware must be performed.

Post-Processing

Small but very important improvements to benefit our DASY6 users have been introduced in the post-processing procedure:

  • Power density distributions can now be computed and visualized simultaneously with different averaging areas
  • The computation time for post-processing of scans is on average 4× faster
  • By default, settings in the “options”-view are adjusted to user the needs
  • The measurement data can be exported at any grid resolution

Note that the post-processing algorithm itself has not been modified.

Report Generation

Review of the “report generator”-tool has resulted in the following improvements:

  • The size of the field plot can now be defined by the user for more consistent result reporting
  • The scalar bar is now considerably larger to improve overall readability

cDASY6 mmWave Module V1.6 Report Generator

E-field distribution measured with a 2D-generic scan in the near-field of the source

Improved Power Density Viewers

The power density viewers have been improved based on the feedback we have received from you:

  • The peak averaged power density is displayed with a grey circle
  • The averaged power density plots have now the same size as the measurement grid. The post processing algorithm uses zero padding to compute the averaged power density where the averaging circle would be truncated. This area is delimited by a dashed grey line on the plot. Averaged power density values outside this line might be underestimated and should not be considered as accurate.

cDASY6 mmWave Module V1.6 FRONT 2 00 0 CW 60000 00MHz 3dcDASY6 mmWave Module V1.6 Savg

Power Density S (left) and Averaged Power Density (right). The averaging circle shows the maximum of the averaged power density. Only values inside the dashed line should be considered as accurate

The next major cDASY6 software release, V2.0, will feature two major optional modules:

  • The Optimizer Module for determination of the worst-case power density of antenna arrays from a series of single-element measurements
  • The Forward Transform Evaluation (FTE) Module for evaluation of the power density distribution along any virtual surface (e.g., SAM Head) from a single measurement and estimation of the radiation pattern

For further information, please contact us at info@speag.swiss.

MEASUREMENT

28/03/2013

Contact
info@speag.swiss

 

New DAK Movie

Release of a brief training video with tips on how to increase the precision of dielectric measurements.

 
MEASUREMENT

14/03/2013

Contact
info@speag.swiss

 

TDS (Time Domain Sensor) Release*

We are pleased to announce the release of our TDS Standalone systems. TDS Standalone is the first product of our growing TDS product range to employ SPEAG’s novel active optical sensor technology for E- and H-field measurements in the frequency range from 10 MHz – 6 GHz.

*available in the US and Canada after final certification in accordance with the regulations of the US FDA, CDRH, CFR 21, Section I, subchapter J, part 1002 to 1040.11 (expected in May 2013).

 
MEASUREMENT

04/03/2013

Contact
info@speag.swiss

 

Solid Spacer V2

We are pleased to announce the release of the optimized spacers SPACERS V2 for our CTIA hand phantoms SHO X.

 

 
MEASUREMENT

25/02/2013

Contact
info@speag.swiss

 

New Product: POPEYE

In response to customer requests for more versatile phantoms, SPEAG introduces several new whole-body and hand phantoms.

 
MEASUREMENT

11/02/2013

Contact
info@speag.swiss

 

DAK-1.2 Release & Software Update

We are pleased to announce the release of the optimized high frequency dielectric probe DAK-1.2 covering the frequency range 5 – 50 GHz. At the same time, we extended and improved the features of our software that is now available for download. 

 
CORPORATE

19/01/2013

Contact
info@speag.swiss

 

Electrified into 2013

The most spectacular Annual Party in recent memory: the IT'IS - Speag - ZMT "Electrified into 2013 Party".

 
MEASUREMENT

14/01/2013

 

Audio Interference Analyzer (AIA)

This AIA enables the DASY52 Users to directly measures the Modulation Interference Factor (MIF) and the Probe Modulation Factor (PMF) of modulated radiofrequency (RF) signals. It is also perfectly suited for establishing the connection between base-station emulator and the device under test (DUT). 

 
CORPORATE

31/12/2012

Contact
info@speag.swiss

 

Successful SPEAG exhibtions and workshops during 2012

SPEAG successfully participated on multiple international conferences and exhibitions during 2012.

 
SIMULATION

21/12/2012

Contact
semx-support@speag.swiss

 

SEMCAD X v14.8.2 Update Release

The SEMCAD X Team is pleased to announce the release of SEMCAD X v14.8.2, an update of SEMCAD X Aletsch v14.8.

 
CORPORATE

30/11/2012

Contact
info@speag.swiss

 

Innovation Retreat

The success and achievements of the Bell Labs have inspired generations of engineers, physicists, product developers, and other scientists. These accomplishments and the success stories of our greatest inventors have also inspired 21 Speag, ZMT, and IT'IS coworkers who gathered in Flüeli-Ranft on Novenber 22nd-23rd to get under the hood of our our own innovation engine.

 
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