DAK-TL2 for Fast and Precise Dielectric Measurements of Thin Layers

Base Unit

The fully automated and software controlled DAK-TL2 base unit, designed for use with any of the three DAK-TL2 probes, is connected via USB to a PC. The sample platform with its built-in force sensor brings the sample to the probe for measurement of its thickness with micrometer precision. 

• Thickness measurement range: 0.1 – 10 mm
• Force measurement range: 0 – 1000 N
• USB connector: Type B
• Weight: ~16 kg
• Operating temperature range: 10 – 50 °C
• Thickness measurement precision: <3 µm

DAK12-TL2 (4 - 600 MHz)

• Probe connector type: 3.5 mm male
• Outer conductor inner diameter: 12 mm
• Inner conductor diameter: 3.18 mm
• Flange diameter: 68 mm
• Dielectric bead material: Eccostock
• Flange: Stainless steel
• Beam dimensions: 40 × 30 × 350 mm
• Robustness: High resistance to corrosive materials
• High measurement repeatability (typ. within ± 1%)
• Accuracy: Uncertainty tables based on material properties, frequency, and sample thickness are available upon request

DAK3.5-TL2 (200 MHz - 20 GHz)

• Probe connector type: 3.5 mm male
• Outer conductor inner diameter: 3.5 mm
• Inner conductor diameter: 0.93 mm
• Flange diameter: 48 mm
• Dielectric bead material: Eccostock
• Flange: Stainless steel
• Beam dimensions: 40 × 30 × 350 mm
• Robustness: High resistance to corrosive materials
• High measurement repeatability (typ. within ± 1%)
• Accuracy: Uncertainty tables based on material properties, frequency, and sample thickness are available upon request

DAK1.2E-TL2 (5 - 67 GHz)

• Probe connector type: 1.85 mm male
• Outer conductor inner diameter: 1.2 mm
• Inner conductor diameter: 0.28 mm
• Flange diameter: 48 mm
• Dielectric bead material: Epoxy
• Flange: Stainless steel
• Beam dimensions: 40 × 30 × 350 mm
• Robustness: High resistance to corrosive materials
• High measurement repeatability (typ. within ± 1%)
• Accuracy: Uncertainty tables based on material properties, frequency, and sample thickness are available upon request

Applications

• Evaluation of raw printed circuit board materials
• Characterization of microwave substrates, antenna and casing materials
• Analysis of dielectric materials for electronic components, e.g., capacitors, coils, resonators
• Characterization of liquids available in only small quantities, e.g., precious pharmaceutical or biochemical samples
• Evaluation of small biological samples, e.g., human skin, tumor tissue

Calibration

Calibration according to SPEAG's high-quality standards; DAK probe calibration included within the scope of SPEAG's ISO/IEC 17025 accreditation; suitable for measurements with small and known tolerances.

Components

SPEAG provides all necessary components to perform high-precision measurements with DAK-TL2:

• DAK-TL2 calibration set
• Stand for VNA
• Metal shorting plate
• Metal petri-dish and top plate for liquid measurement
• High-precision cables to connect the probe beam to the VNA port

VNA Compatibility

DAK-TL2 is compatible with the most popular VNAs on the market (please see our list of currently supported VNAs). For further information about our attractive system packages with the VNA from Rohde & Schwarz contact us at info@speag.swiss.

Software

The software provides the following functionalities:

• Modern intuitive graphical user interface (GUI)
• Choice of complex permittivity parameters (ε', ε", σ, tan δ) reported in a variety of data formats: linear plots, logarithmic plots, Smith charts, Cole-Cole plots, and tables
• Robust data analysis suite for fitting data to analytical curves and for comparison to target parameters with tolerance and uncertainty ranges
• Streamlined workflow for dielectric measurements
• Fast and robust VNA control, data acquisition, and calculation of dielectric parameters
• Averaging function and numerical noise filtering
• Flexible scripting for measurement automation and hardware customization

Computer Requirements

The software must be run on an external computer, not on the VNA and runs only on 64 bit Windows operating systems. Operating system: Windows 11, 10, 8, 8.1 or 7.

The following hardware requirements must be met:

• Processor: Intel Core i9, Xeon (or AMD equivalent), 8 cores minimum
• 4 GB of RAM
• Dedicated 3D accelerated graphics display adapter card with at least 128 MB of on-board memory that supports the latest OpenGL drivers (v3.2 or higher); note: graphics cards of the AMD Radeon™ HD 7500M/7600M Series must run on the latest driver version
• A display with 32-bit color depth and a resolution of 1280 × 1024 pixels or better (optimum size: 1920 × 1200 pixels)

Unique Features

Fast and accurate conversion of S₁₁ to dielectric properties by means of the direct solver to reduce calculation uncertainty

Novel multilayer algorithm to compensate for the formation of an air-gap between the sample and the probe for both calibration and measurement

Built-in Python interface for powerful extended control of equipment and data analysis

Automatic thickness measurement with μm accuracy to improve efficiency of the set up process 

Up to 1000 N

Made of a well-characterized lossy material to minimize the unwanted flange resonance effects

ε_r: 1–800
tan δ: 0.001–10

Compatibility

The DAK-TL2 upgrade kit is compatible with DAK-TL base units with P/N: SM DAK 4P1 DA

Note that if your hardware on-site has an older P/N version, upgrades must be performed by SPEAG; in this case please contact info@speag.swiss for further instructions.

Product History

DAK-TL2 replaces DAK-TL, which was discontinued in August 2020 – contact us at info@speag.swiss if you are interested in upgrading your DAK-TL unit to DAK-TL2!

Release Date

2020Q4