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NEWS
Apr 8, 2025
2025

Latest Updates from the TCB Council Workshop of April 1 – 3

SPEAG Committed to Make Use of New PIA Process

The semi-annual TCB Council Workshop took place on April 1 – 3, this time in Santa Clara, California, where the latest scientific, standards and regulatory developments were presented.

Dr. Alfonso Tarditi, Technical Research Branch Chief at the U.S. Federal Communications Commission (FCC), introduced the use of an existing persistent inquiry approval (PIA) process to incorporate specific absorption rate (SAR) phantoms not yet listed in KDB 865664-D01. When a PIA is approved, test labs can make use of it without the need to submit a PAG. This will accelerate the application of advanced compliance testing methods. SPEAG is committed to submitting a series of PIAs to make the certification process easier.

Slide presented by FCC at TCBC Workshop summarizing new PAG process utilizing persistent inquiry approval.

ISED Canada summarized their recent activity, including the updates to the RSS-102 series of documents. The consultation period recently closed for RSS-102.SAR.MEAS Issue 2 (SAR measurements, with new time-average SAR requirements) and RSS-102.SAR.SIM Issue 1 (SAR simulations). There is an open consultation, until May 30, for incident power density (IPD) measurements (RSS-102.IPD.MEAS Issue 2, with extended frequency range and new time-average IPD procedures) and IPD simulations (RSS-102.IPD.SIM Issue 2).

For further information, please contact us at info@speag.swiss or any of our sales channels.

Kind regards,

Your SPEAG Team

NEWSQUARTER

Apr 1, 2025

 

 
MEASUREMENT

Mar 18, 2025

Contact
info@speag.swiss

 

DASY8 Module APD V1.2 Adopted by Regulators

DASY8 Module APD has been upgraded and further enhanced with the new DAE8APD, PHA-30GV2, and software version 1.2, resulting in improved measurement speed and precision. Module APD V1.2 systems have been delivered and successfully installed at the sites of two major regulators in Japan and South Korea, underpinning the progressive regulatory adoption of our technology.

 
2025

Mar 4, 2025

Contact
info@speag.swiss

 

DAK-R for Multi-Frequency Measurement of Low-Loss Dielectric Materials

SPEAG’s latest advancement in dielectric measurement instruments – the DAK-Resonator (DAK-R) – allows precise determination of low-loss material properties at 10, 17, 26, 35, and 45 GHz – all in a single measurement! DAK-R optimally complements our existing DAK-TL2 systems for measurements of thin-layers.

 
CORPORATE

Jan 22, 2025

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info@speag.swiss

 

Zurich43 Retreat 2025: ChatGPT and Generative AI

End of January, participants gathered for the annual Z43 retreat to explore the transformative impact of generative AI across disciplines and to address ethical implications, future projects, and internal guidelines for AI use and development.

 
CORPORATE

Jan 3, 2025

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info@speag.swiss

 

EMCO Elektronik GmbH and SPEAG Sign Distributor Agreement

From January 2, 2025, EMCO Elektronik GmbH will begin sales and support of SPEAG’s advanced electromagnetic solutions in Germany

 
NEWSQUARTER

Dec 28, 2024

 

 
2024

Dec 12, 2024

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info@speag.swiss

 

DASY8/6 Module WPT V2.8: Enhanced for Dynamic Charger Testing

DASY8/6 Module WPT V2.8 includes new features that enable automated testing of the latest generation of rapid chargers based on FSK/ASK communication for optimized charging performance.

 
CORPORATE

Nov 27, 2024

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info@speag.swiss

 

A Night to Remember: Celebrating Our Jubilees in Style

On November 22, Z43 celebrated five jubilees in one incredible evening! It was a night to remember – from the delicious food and drinks to vibrant conversations and new connections, we celebrated in style!

 
CORPORATE

Nov 27, 2024

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info@speag.swiss

 

SPEAG and ZMT Distributor Week 2024

Z43 partners SPEAG and ZMT host the 2024 distributor week in Zurich with our global sales channels.

 
2024

Nov 21, 2024

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DASY8-3D V1.8 with TAS and APD

The latest release adds time-averaged specific absorption rate and absorbed power density to the testing capabilities of DASY8-3D, enhancing its power for comprehensive, automated, high-throughput evaluations of thousands of configurations now found in the latest smart wireless devices.

 
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