Release of ICEy-mmW Module V1-0

SPEAG’s millimeter-wave E-field probe EUmmWV2 is a major breakthrough for 5G certifications: it permits precise very close near-field measurements for frequencies up to 110 GHz. The recent integration of the probe into our reactive near-field scanning system ICEy now introduces micrometer precision and a high level of automation in demonstrating power density compliance of 5G and WiGig (Wireless Gigabit) devices operating above 10 GHz.

Building on the verified and validated feature sets of ICEy for chip- to system-level EMC testing and DASY6 for SAR and power density testing, the novel ICEy-mmW module allows to establish a graphical measurement setup based on a micrometer-precision optical 3D reconstruction of the device under test (DUT), computer aided placement of arbitrarily oriented evaluation planes, as well as fully automated and contact-less near-field scans as close as 2 mm from the source. The micrometer accuracy of ICEy allows to resolve even the smallest elements of millimeter wave antennas and to directly overlay the results over 3D model of the DUT in the post-processor. The overall uncertainty of ICEy for the compliance test with power density limits is <1.4 dB.

By combining the new module with the features of SEMCAD X, the configurations needed for the compliance report to the Federal Communications Commission (FCC) and other regulators can be efficiently determined, meaning that the measurements are not only accurate but the entire procedure becomes very straightforward and time efficient.

Comparison of the reconstructed power density of a 30 GHz dipole array from a simulation with SEMCAD X (left) versus measurements with ICEy (right) averaged over any surface of 1 cm².

Our ICEy-mmW Module V1-0 offers the following unique features:

• reconstruction of the DUT surface with better than 25 µm resolution;
• computer aided placement of the evaluation planes on the reconstructed 3D model of the DUT;
• evaluation planes arbitrarily oriented in space;
• fully automated scans without the need for mechanical surface detection;
• scripting interface to control external equipment at all stages of the scan;
• field and power density viewers;
• direct result overlay on the 3D model of the DUT;
• optimized summary table and report generation;
• export of all measured and processed data to .csv and .mat;
• all features integrated in the turnkey ICEy system.

The release has also been validated using the validation system proposed in the latest draft report of the IEC.

For more information or for receiving a quote and updates on the delivery schedule, please contact us at info@speag.swiss.