EMC SOLUTION
SEMCAD X Matterhorn EMC Solution harnesses the full power of FDTD to solve and accurately predict emission and EM compatibility (EMC) issues. Accurate emission and interference testing is extended beyond standard measurements, and time to market is significantly accelerated, to achieve a competitive edge.
Adaptive, rectilinear meshes can be generated interactively with excellent heuristics-based automatic grid generation and flexible tuning.
Drag-and-drop-based assignments are supported, and powerful interactive handling is featured (e.g., in geometric modeling, simulation coupling, and material assignment).
A novel pipeline architecture allows for the setup of complex analysis sequences and simple re-evaluations with modified input data or parameters. Analysis steps can be stored in and re-loaded from analysis or visualization “projects.”
Application Areas
- Interference and emission simulations
- Virtual transverse EM (TEM) cells
- Virtual anechoic and reverberation chambers
- Printed circuit board (PCB) noise radiation
- Nuclear EM pulse testing in a semi-anechoic chamber
- GPU chip and board simulations
- PCB CAD import engine
- Optimization of signal integrity on multilayer PCBs
- Automated electrostatic discharge (ESD) simulations
Selected Features
- Transient, broadband, and
harmonic simulations (time-
domain solver) - Results from time and
frequency domains - Unique FDTD/GPU subgridding scheme (structure-adaptive)
- Automatic simulation
termination - Autoregressive moving-average (ARMA) engine for early detection of time convergence
- Non-homogeneous intelligent gridder engine (geometry detection)
- Run-time monitoring
- New powerful engine for parametrization/sweeps
- Automatization for ESD simulation
- User-defined signal source
(pulse, step, saw, arbitrary,
etc.)
- Discrete sources (1D, single edge)
- Plane-wave and Huygens box
- Lossy dielectric and magnetic materials
- Automation, analysis, and customization via a Python scripting environment (script generator)
- Volume rendering, interpolation on arbitrary 3D structures, surface field rendering
- Lumped elements (R, L, C, predefined serial/parallel)
- Absorbing boundary conditions. (ABC), perfect electric conductor (PEC), perfect magnetic conductor (PMC), periodic boundaries
- Analytic boundaries (Mur,
Higdon) - Uni-anisotropic perfectly matched layer (UPML) and convolutional perfectly matched layer (CPML) boundaries with adjustable absorption
- Execution by means of command line or graphical user interface (GUI)
- Surface impedance boundary conditions (SIBC) accelerated for broadband and harmonic
simulations - Import /display of external measurement data (SPEAG scanners)
- Analysis Workbench (graphical, manipulation of outputs)
